Method for manufacturing silicon device

ABSTRACT

A method for manufacturing a silicon device includes steps of: forming a silicon layer  4   a  that indicates a second conductivity type on a first surface S 1   a  of a silicon substrate  2   a  that indicates a first conductivity type; and exposing, after the step, a third surface S 3   a  of the silicon layer  4   a  for a period of a minimum of 30 minutes and a maximum of 6 hours to an argon-containing atmosphere which is adjusted to temperatures of a minimum of 400° C. and a maximum of 900° C. and pressures of a minimum of 4 MPa and a maximum of 200 MPa.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a method for manufacturing a silicon device.

2. Related Background Art

Conventionally, various methods for improving physical properties possessed by a silicon material, such as a single-crystal silicon substrate, have been developed. For example, as is described in Patent Document 1 (Japanese Published Unexamined Patent Application No. H08-139359), there is known a processing method in which single crystal silicon is anodized in a hydrofluoric acid solution to form a porous state on the silicon surface, and other similar methods. With this processing method, a porous silicon of which emission intensity of a visible light is higher than that of the single crystal silicon (which emits very weak light of 1.13 μm at room temperature) is obtained. Therefore, the formation of the porous silicon leads to implementation of improvement in the light-emission intensity, which is one of the physical properties possessed by the silicon.

SUMMARY OF THE INVENTION

However, the treatment process for improving the light-emission intensity of the silicon material is not a simple process as in the case of manufacturing the porous silicon or the like. Therefore, it is an object of the present invention to provide a method for manufacturing a silicon device, in which an improvement in physical properties such as a light-emission intensity can be implemented by a simple treatment process.

A method for manufacturing a silicon device of the present invention includes steps of: forming a silicon layer that indicates a second conductivity type on a surface of a silicon material that indicates a first conductivity type; and exposing, after the step, a surface of the silicon layer for a period of a minimum of 30 minutes and a maximum of 6 hours to an argon-containing atmosphere which is adjusted to temperatures of a minimum of 400° C. and a maximum of 900° C. and pressures of a minimum of 4 MPa and a maximum of 200 MPa. It may be possible that the silicon material includes a silicon area arranged on the surface of the silicon material and having a thickness inwardly of the silicon material from the surface, and the silicon area is formed of porous silicon or beta iron silicide.

Thus, after the silicon layer that indicates a second conductivity type is formed on the surface of the silicon material of the first conductivity type, argon is added from the surface of the silicon layer. As a result of intensive studies, the inventor found that when the argon is added by exposing the surface of the silicon layer for a period of a minimum of 30 minutes and a maximum of 6 hours to an argon-containing atmosphere which is adjusted to temperatures of a minimum of 400° C. and a maximum of 900° C. and pressures of a minimum of 4 MPa and a maximum of 200 MPa, an intensity of a light emission of a photo luminescence (PL) (PL intensity) is improved, as compared to a case where no argon is added. Furthermore, the inventor also found that when a bias voltage is applied between the silicon material of the first conductivity type and the silicon layer of the second conductivity type, an intensity of a light emission of an electric luminescence (EL) (EL intensity) is improved, as compared to a case where no argon is added. Therefore, according to the present invention, the EL intensity and the PL intensity of the silicon material are improved by a simple treatment process in which the surface of the silicon layer is exposed for a period of a minimum of 30 minutes and a maximum of 6 hours to an argon-containing atmosphere which is adjusted to temperatures of a minimum of 400° C. and a maximum of 900° C. and pressures of a minimum of 4 MPa and a maximum of 200 MPa.

A method for manufacturing a silicon device of the present invention includes steps of: exposing a surface of a silicon material that indicates a first conductivity type for a period of a minimum of 30 minutes and a maximum of 6 hours to an argon-containing atmosphere which is adjusted to temperatures of a minimum of 400° C. and a maximum of 900° C. and pressures of a minimum of 4 MPa and a maximum of 200 MPa; and forming, after the step, a silicon layer that indicates a second conductivity type on the surface of the silicon material. It may be possible that the silicon material includes a silicon area arranged on the surface of the silicon material and having a thickness inwardly of the silicon material from the surface, and the silicon area is formed of porous silicon or beta iron silicide.

Thus, the argon is added from the surface of the silicon material of the first conductivity type. After the argon is added, the silicon layer of the second conductivity type is formed on the surface of the silicon material. As a result of intensive studies, the inventor found that when the argon is added by exposing the surface of the silicon material for a period of a minimum of 30 minutes and a maximum of 6 hours to an argon-containing atmosphere which is adjusted to temperatures of a minimum of 400° C. and a maximum of 900° C. and pressures of a minimum of 4 MPa and a maximum of 200 MPa, the PL intensity is improved as compared to a case where no argon is added. Furthermore, the inventor also found that when a bias voltage is applied between the silicon material of the first conductivity type and the silicon layer of the second conductivity type, the EL intensity is improved as compared to a case where no argon is added. Therefore, according to the present invention, the EL intensity and the PL intensity of the silicon material are improved by a simple treatment process in which the surface of the silicon material is exposed for a period of a minimum of 30 minutes and a maximum of 6 hours to an argon-containing atmosphere which is adjusted to temperatures of a minimum of 400° C. and a maximum of 900° C. and pressures of a minimum of 4 MPa and a maximum of 200 MPa.

A method for manufacturing a silicon device of the present invention includes a step of exposing a surface of a silicon material for a period of a minimum of 30 minutes and a maximum of 6 hours to an argon-containing atmosphere which is adjusted to temperatures of a minimum of 400° C. and a maximum of 900° C. and pressures of a minimum of 4 MPa and a maximum of 200 MPa. It may be possible that the silicon material includes a silicon area arranged on the surface of the silicon material and having a thickness inwardly of the silicon material from the surface, and the silicon area is formed of porous silicon or beta iron silicide.

Thus, the argon is added from the surface of the silicon material. As a result of intensive studies, the inventor found that when the argon is added by exposing the surface of the silicon material for a period of a minimum of 30 minutes and a maximum of 6 hours to an argon-containing atmosphere which is adjusted to temperatures of a minimum of 400° C. and a maximum of 900° C. and pressures of a minimum of 4 MPa and a maximum of 200 MPa, the PL intensity is improved as compared to a case where no argon is added. Therefore, according to the present invention, the PL intensity of the silicon material is improved by a simple treatment process in which the surface of the silicon material is exposed for a period of a minimum of 30 minutes and a maximum of 6 hours to an argon-containing atmosphere which is adjusted to temperatures of a minimum of 400° C. and a maximum of 900° C. and pressures of a minimum of 4 MPa and a maximum of 200 MPa.

According to the present invention, it is possible to implement an improvement in physical properties such as a light-emission intensity by a simple treatment process.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A, FIG. 1B, FIG. 1C, FIG. 1D, and FIG. 1E are cross-sections of a device for describing a method for manufacturing a silicon semiconductor device according to an embodiment, and FIG. 1F is a graph showing a concentration distribution in a depth direction;

FIG. 2A, FIG. 2B, and FIG. 2C are graphs for describing argon adding conditions according to the embodiment;

FIG. 3A and FIG. 3B are graphs showing light-emission characteristics of the silicon semiconductor device according to the embodiment;

FIG. 4A and FIG. 4B are graphs showing light-emission characteristics of the silicon semiconductor device according to the embodiment;

FIG. 5A, FIG. 5B, FIG. 5C, FIG. 5D, and FIG. 5E are cross-sections of a device for describing a method for manufacturing a silicon semiconductor device according to an embodiment, and FIG. 5F is a graph showing a concentration distribution in a depth direction;

FIG. 6A and FIG. 6B are cross-sections of a device for describing a method for manufacturing a silicon semiconductor device according to an embodiment, and FIG. 6C is a graph showing a concentration distribution in a depth direction;

FIG. 7A, FIG. 7B, FIG. 7C, FIG. 7D, and FIG. 7E are cross-sections of a device for describing a method for manufacturing a silicon semiconductor device according to an embodiment, and FIG. 7F is a graph showing a concentration distribution in a depth direction;

FIG. 8A and FIG. 8B are graphs showing light-emission characteristics of the silicon semiconductor device according to the embodiment;

FIG. 9A and FIG. 9B are graphs showing light-emission characteristics of the silicon semiconductor device according to the embodiment;

FIG. 10A, FIG. 10B, FIG. 10C, FIG. 10D, and FIG. 10E are cross-sections of a device for describing a method for manufacturing a silicon semiconductor device according to an embodiment, and FIG. 10F is a graph showing a concentration distribution in a depth direction; and

FIG. 11A and FIG. 11B are cross-sections of a device for describing a method for manufacturing a silicon semiconductor device according to an embodiment, and FIG. 11C is a graph showing a concentration distribution in a depth direction.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, with reference to the drawings, a semiconductor device, which is one example of a preferred embodiment, to which the present invention is applied will be described in detail. It is noted that in the descriptions of the drawings, identical components are designated by the same reference numerals so that overlapping description may be omitted, where possible.

First Embodiment

With reference to FIG. 1A, FIG. 1B, FIG. 1C, FIG. 1D, FIG. 1E, and FIG. 1F, a method for manufacturing a silicon device according to a first embodiment will be described. A silicon device according to the first embodiment is a silicon semiconductor device 1 a. First, a silicon substrate 2 a (silicon material) is prepared (FIG. 1A). The silicon substrate 2 a includes a first surface S1 a and a second surface S2 a opposite the first surface S1 a.

Subsequently, a silicon layer 4 a is formed on the first surface S1 a of the silicon substrate 2 a (FIG. 1B). The silicon layer 4 a contains impurities that indicate a second conductivity type different from a first conductivity type. A pn junction portion is formed by the silicon substrate 2 a and the silicon layer 4 a. The silicon layer 4 a includes a third surface S3 a opposite a junction surface with the silicon substrate 2 a. The thickness of the silicon layer 4 a is approximately 50 nm to several μm. In the first embodiment, the first conductivity type is an n-type and the second conductivity type is a p-type. However, the first conductivity type may be the p-type and the second conductivity type may be the n-type.

By using an HIP (Hot Isostatic Pressing) device, argon is then added from the third surface S3 a of the silicon layer 4 a. In this case, the silicon substrate 2 a is mounted on a substrate-loading base within the HIP device. The second surface S2 a of the silicon substrate 2 a is in contact with the surface of the base. The third surface S3 a is then exposed for 30 minutes to 6 hours to an argon-containing atmosphere which is adjusted to temperatures of 400° C. to 900° C. and pressures of 4 MPa to 200 MPa. Thereby, the argon is added from the third surface S3 a. The addition of the argon forms an argon added area 6 a (FIG. 1C). Argon adding conditions are: under the argon atmosphere, pressures of 4 MPa to 200 MPa; temperatures of 400° C. to 900° C.; and a processing time of 30 minutes to 6 hours. The argon added area 6 a is formed in a semiconductor area formed of the silicon substrate 2 a and the silicon layer 4 a. The argon added area 6 a is formed from the third surface S3 a of the silicon layer 4 a to the inside of the above-described semiconductor area.

In FIG. 1F, an argon concentration profile in the argon added area 6 a is shown (see reference numeral P1 in the graph). The argon is distributed from an exposed-surface position z1 of the silicon layer 4 a to a depth position z2 within the silicon substrate 2 a. In an example shown in this argon concentration profile, the argon added area 6 a reaches from the third surface S3 a of the silicon layer 4 a to the interior of the silicon substrate 2 a. The argon added area 6 a includes an area indicating an argon concentration of 1×10¹⁸ cm⁻³ to 2×10²⁰ cm⁻³. The argon added area 6 a preferably includes an area indicating an argon concentration of 2×10¹⁸ cm⁻³ to 1×10²⁰ cm⁻³. As a method for adding the argon, any method such as an ion implantation method, a sputtering method, or the like, may be used.

Subsequently, a passivation film 81 is formed on the third surface S3 a of the silicon layer 4 a (FIG. 1D). A passivation film 8 a is a silicon oxide film, for example. Subsequently, a contact hole H1 a is arranged in this passivation film 81 to form the passivation film 8 a, and a second electrode 14 a is formed on the passivation film 8 a and a first electrode 12 a is formed on the second surface S2 a of the silicon substrate 2 a. The first electrode 12 a and the second electrode 14 a are made of a conductive metal (aluminum or the like, for example). Thereafter, through a process such as dicing, the silicon semiconductor device 1 a is manufactured (FIG. 1E).

FIGS. 2A, 2B, and 2C show a correlation between the argon adding conditions (pressure, temperature, and processing time) and a PL intensity. FIG. 2A shows a correlation between the pressure in the argon atmosphere and the PL intensity under argon adding conditions in which a temperature is approximately 800° C. and a processing time is approximately 6 hours. A horizontal axis of the graph shown in FIG. 2A represents a pressure (MPa), and a vertical axis represents a PL intensity (arb. units). As shown in FIG. 2A, when the PL intensity in a case where the pressure is approximately as high as an atmospheric pressure is “2” (units) (see data of reference numeral D1 in the graph), if the argon is added under argon adding conditions in which a temperature is approximately 800° C.; pressures are approximately 4 MPa (see data of reference numeral D2 in the graph) to 200 MPa (see data of reference numeral D3 in the graph) (or a pressure is 4 MPa or more); and a processing time is approximately 6 hours, the PL intensity increases by approximately 13 times to 63 times, as compared to a case where the pressure is approximately as high as the atmospheric pressure. According to the data shown in FIG. 2A, when the pressure becomes higher, the PL intensity increases as well.

FIG. 2B shows a correlation between the temperature in the argon atmosphere and the PL intensity under argon adding conditions in which a pressure is approximately 180 MPa and a processing time is approximately 6 hours. A horizontal axis of the graph shown in FIG. 2B represents a temperature (Celsius), and a vertical axis thereof represents a PL intensity (arb. units). As shown in FIG. 2B, the argon is preferably added under argon adding conditions in which temperatures are approximately 400° C. (see data of reference numeral D4 in the graph) to approximately 900° C. (see data of reference numeral D5 in the graph) (or a temperature is 400° C. or more); a pressure is approximately 180 MPa; and a processing time is approximately 6 hours. The argon is more preferably added under argon adding conditions in which temperatures are approximately 600° C. (see data of reference numeral D6 in the graph) to approximately 900° C. (see data of reference numeral D5 in the graph); a pressure is approximately 180 MPa; and a processing time is approximately 6 hours.

FIG. 2C shows a correlation between the processing time and the PL intensity under argon adding conditions in which a pressure is approximately 180 MPa and a temperature is approximately 800° C. A horizontal axis of the graph shown in FIG. 2C represents a processing time (hour), and a vertical axis thereof represents a PL intensity (arb. units). According to the data shown in FIG. 2C, under the argon adding conditions in which a temperature is approximately 800° C. and a pressure is approximately 180 MPa, if the processing time becomes longer, the PL intensity increases as well. In particular, when the processing time is 2 hours or longer (see each piece of data of reference numerals D7, D8, and D9 in the graph), the PL intensity is high.

Subsequently, with reference to FIG. 3A, FIG. 3B, FIG. 4A, and FIG. 4B, light-emission characteristics of the silicon semiconductor device 1 a manufactured by a method for manufacturing the silicon device according to the above-described first embodiment will be described. FIG. 3A and FIG. 3B show data indicating PL (Photo Luminescence) light-emission characteristics of the silicon semiconductor device 1 a. Both the data shown in FIG. 3A and FIG. 3B are measured at room temperature. FIG. 3A shows data (data indicated by reference numeral A1 in the graph) showing a correlation between a wavelength of a PL light emission and a PL intensity in the silicon semiconductor device 1 a at an argon concentration of approximately 1×10¹⁹ cm⁻³. FIG. 3A also shows data (data indicated by reference numeral A2 in the graph) showing a correlation between a wavelength of a PL light emission and a PL intensity in the silicon device to which no argon is added. A horizontal axis of the graph shown in FIG. 3A represents a wavelength (nm) of the PL light emission, and a vertical axis thereof represents a PL intensity (arb. units). The PL intensity was measured at room temperature, in which an Nd:YVO4 laser of 532 nm was used as excitation and an infrared photomultiplier (Hamamatsu Photonics R5509-72) was used for detection. According to the data shown in FIG. 3A, the PL intensity (1.13 μm band) of the silicon semiconductor device 1 a at an argon concentration of approximately 1×10¹⁹ cm⁻³ increases by 50 times or more than the PL intensity (1.13 g/m band) of the silicon device to which no argon is added. Thus, in the silicon semiconductor device 1 a at an argon concentration of approximately 1×10¹⁹ cm⁻³, the PL intensity is significantly improved.

FIG. 3B shows a correlation between an argon concentration of the silicon semiconductor device 1 a and a PL intensity in the 1.13 μm band. A horizontal axis of the graph shown in FIG. 3B represents an argon concentration (cm⁻³), and a vertical axis thereof represents a PL intensity (arb. units) in the 1.13 μm band. According to the data shown in FIG. 3B, when the PL intensity in a case where no argon is added is “1” (units), the PL intensity at an argon concentration of 1×10¹⁸ cm⁻³ (see data of reference numeral D10 in the graph) to 2×10²⁰ cm⁻³ (see data of reference numeral D11 in the graph) increases by 10 times to 100 times or more, as compared to a case where no argon is added. Thus, the PL intensity is significantly improved when the argon concentration is in a range of 1×10¹⁸ cm⁻³ to 2×10²⁰ cm⁻³.

In particular, the PL intensity at an argon concentration of 2×10¹⁸ cm⁻³ (see data of reference numeral D12 in the graph) to 1×10²⁰ cm⁻³ (see data of reference numeral D13 in the graph) increases by 30 times to 100 times or more, as compared to a case where no argon is added. Thus, the PL intensity is significantly improved when the argon concentration is in a range of 2×10¹⁸ cm⁻³ to 1×10²⁰ cm⁻³. When the concentration is within ±50% of the concentration of D13, at least the PL intensity is significantly increased.

FIG. 4A and FIG. 4B show data indicating EL (Electric Luminescence) light-emission characteristics of the silicon semiconductor device 1 a. Both the data shown in FIG. 4A and FIG. 4B are measured at room temperature. FIG. 4A shows data (data indicated by reference numeral A3 in the graph) showing a correlation between a wavelength of an EL light emission and an EL intensity in the silicon semiconductor device 1 a at an argon concentration of approximately 2×10¹⁹ cm⁻³. FIG. 4A also shows data (data indicated by reference numeral A4 in the graph, and this data is obtained by magnifying the actual data by 100 times) showing a correlation between a wavelength of an EL light emission and an EL intensity in the silicon device to which no argon is added. A horizontal axis of the graph shown in FIG. 4A represents a wavelength (nm) of the EL light emission, and a vertical axis thereof represents an EL intensity (arb. units). The EL intensity was measured at room temperature, in which a pulse power supply of 100 Hz (implantation current density was 2 A/cm⁻³) was used, and an infrared photomultiplier (Hamamatsu Photonics R5509-72) was used for detection. According to the data shown in FIG. 4A, the EL intensity (1.1 μm band) of the silicon semiconductor device 1 a at an argon concentration of approximately 2×10¹⁹ cm⁻³ increases by approximately 2000 times than the EL intensity (in 1.1 μm band) of the silicon device to which no argon is added. Thus, in the silicon semiconductor device 1 a at an argon concentration of approximately 2×10¹⁹ cm⁻³, the EL intensity is significantly improved.

FIG. 4B shows a correlation between an argon concentration of the silicon semiconductor device 1 a and an EL intensity in the 1.13 μm band. A horizontal axis of the graph shown in FIG. 4B represents the argon concentration (cm⁻³), and a vertical axis thereof represents the EL intensity (arb. units) in the 1.13 μm band. According to the data shown in FIG. 4B, when the EL intensity in a case where no argon is added is “1” (units), the EL intensity at an argon concentration of 1×10¹⁸ cm⁻³ (see data of reference numeral D14 in the graph) to 2×10²⁰ cm⁻³ (see data of reference numeral D15 in the graph) increases by 200 times to 2000 times or more, as compared to a case where no argon is added. As described above, the EL intensity is significantly improved when the argon concentration is in a range of 1×10¹⁸ cm⁻³ and 2×10²⁰ cm⁻³.

In particular, the EL intensity at an argon concentration of 2×10¹⁸ cm⁻³ (see data of reference numeral D16 in the graph) to 1×10²⁰ cm⁻³ (see data of reference numeral D17 in the graph) increases by 1000 times to 2000 times or more, as compared to a case where no argon is added. When the concentration is within ±50% of the concentration of D17, at least the EL intensity is significantly increased. As described above, the EL intensity is more significantly improved when the argon concentration is in a range of 2×10¹⁸ cm⁻³ to 1×10²⁰ cm⁻³. Therefore, according to the data shown in FIG. 3A, FIG. 3B, FIG. 4A, and FIG. 4B, the argon concentration of the silicon semiconductor device 1 a is preferably in a range of 1×10¹⁸ cm⁻³ to 2×10²⁰ cm⁻³, and more preferably in a range of 2×10¹⁸ cm⁻³ to 1×10²⁰ cm⁻³.

Furthermore, the inventor confirms that a response speed of the EL light emission of the silicon semiconductor device 1 a at an argon concentration is in a range of 2×10¹⁸ cm⁻³ to 1×10²⁰ cm⁻³ reaches approximately 20 ns from 1 μs or greater, which is approximately 50 times faster as compared to that of the silicon device to which no argon is added.

Second Embodiment

Subsequently, with reference to FIG. 5A, FIG. 5B, FIG. 5C, FIG. 5D, FIG. 5E, and FIG. F, a method for manufacturing a silicon device according to a second embodiment will be described. The silicon device according to the second embodiment is a silicon semiconductor device 1 b. First, a silicon substrate 2 b (silicon material) is prepared (FIG. 5A). The silicon substrate 2 b includes a first surface S1 b and a second surface S2 b opposite the first surface S1 b.

By using the HIP device, the argon is then added from the first surface S1 b of the silicon substrate 2 b. In this case, the silicon substrate 2 b is mounted on a substrate-loading base within the HIP device. The second surface S2 b of the silicon substrate 2 b is in contact with the surface of the base. The first surface S1 b is exposed for 30 minutes to 6 hours to an argon-containing atmosphere which is adjusted to temperatures of 400° C. to 900° C. and pressures of 4 MPa to 200 MPa. Thereby, the argon is added from the first surface S1 b. The addition of the argon forms an argon added area 6 b (FIG. 5B). Argon adding conditions are: under the argon atmosphere, pressures of 4 MPa to 200 MPa; temperatures of 400° C. to 900° C.; and a processing time of 30 minutes to 6 hours. The argon added area 6 b is an area to which argon (Ar) is added, and is formed in a semiconductor area formed of the silicon substrate 2 b and a silicon layer 4 b. The argon added area 6 b is formed from the first surface S1 b of the silicon substrate 2 b to the inside of the silicon substrate 2 b.

In FIG. 5F, an argon concentration profile in the argon added area 6 b is shown (see reference numeral P2 in the graph). The argon is distributed from a surface depth position z3 of the silicon substrate 2 b to a depth position z4 within the silicon substrate 2 b. As shown in the argon concentration profile, the argon concentration has its peak in the vicinity of the first surface S1 b. The argon added area 6 b includes an area indicating an argon concentration of 1×10¹⁸ cm⁻³ to 2×10²⁰ cm⁻³. The argon added area 6 a more preferably includes an area indicating an argon concentration of 2×10¹⁸ cm⁻³ to 1×10²⁰ cm⁻³. As a method for adding the argon, any method such as an ion implantation method, a sputtering method, or the like, may be used.

Subsequently, a silicon layer 4 b is formed on the first surface S1 b of the silicon substrate 2 b (FIG. 5C). The silicon layer 4 b contains impurities that indicate a second conductivity type different from a first conductivity type. A pn junction portion is formed by the silicon substrate 2 b and the silicon layer 4 b. The silicon layer 4 b includes a third surface S3 b opposite a junction surface with the silicon substrate 2 b. The thickness of the silicon layer 4 b is approximately 50 nm to several μm. In the second embodiment, the first conductivity type is an n-type and the second conductivity type is a p-type. However, the first conductivity type may be the p-type and the second conductivity type may be the n-type. Subsequently, a passivation film 82 is formed on the third surface S3 b of the silicon layer 4 b (FIG. 5D). A passivation film 8 b is a silicon oxide film, for example. Next, a contact hole H1 b is arranged in this passivation film 82 to form the passivation film 8 b, and a second electrode 14 b is formed on the passivation film 8 b and a first electrode 12 b is formed on the second surface S2 b of the silicon substrate 2 b. The first electrode 12 b and the second electrode 14 b are made of a conductive metal (aluminum or the like, for example). Thereafter, through a process such as dicing, the silicon semiconductor device 1 b is manufactured (FIG. 5E).

A correlation between argon adding conditions (pressure, temperature, and processing time) and a PL intensity according to the second embodiment is similar to that between the argon adding conditions (pressure, temperature, and processing time) and the PL intensity according to the above-described first embodiment (that is, the correlations shown in FIG. 2A, FIG. 2B, and FIG. 2C). Thus, a description of the correlation between the argon adding conditions (pressure, temperature, and processing time) and the PL intensity according to the second embodiment is omitted. Light-emission characteristics of the silicon semiconductor device 1 b manufactured by a method for manufacturing the silicon device according to the above-described second embodiment are similar to those of the silicon semiconductor device 1 a according to the above-described first embodiment (that is, the light-emission characteristics shown in FIG. 3A, FIG. 3B, FIG. 4A, and FIG. 4B). Thus, a description of the light-emission characteristics of the silicon semiconductor device 1 b is omitted.

Third Embodiment

Subsequently, with reference to FIG. 6A, FIG. 6B, and FIG. 6C, a method for manufacturing a silicon device according to a third embodiment will be described. The silicon device according to the third embodiment is a silicon semiconductor device 1 c. First, a silicon substrate 2 c (silicon material) is prepared (FIG. 6A). The silicon substrate 2 c has a first surface S1 c.

Subsequently, by using the HIP device, the argon is added from the first surface S1 c of the silicon substrate 2 c. In this case, the silicon substrate 2 c is mounted on a substrate-loading base within the HIP device. A surface opposite the first surface S1 c of the silicon substrate 2 c is in contact with the surface of the base. The first surface S1 c is exposed for 30 minutes to 6 hours to an argon-containing atmosphere which is adjusted to temperatures of 400° C. to 900° C. and pressures of 4 MPa to 200 MPa. Thereby, the argon is added from the first surface S1 c. The addition of the argon forms an argon added area 6 c. Argon adding conditions are: under the argon atmosphere, pressures of 4 MPa to 200 MPa; temperatures of 400° C. to 900° C.; and a processing time of 30 minutes to 6 hours. The argon added area 6 c is an area to which the argon is added within the silicon substrate 2 c. The argon added area 6 c is formed from the first surface S1 c of the silicon substrate 2 c to the inside of the silicon substrate 2 c.

In FIG. 6C, an argon concentration profile in the argon added area 6 c is shown (shown by reference numeral P3 in the graph). The argon is distributed from a surface depth position z5 of the silicon substrate 2 c to a depth position z6 within the silicon substrate 2 c. As shown in the argon concentration profile, the argon concentration has its peak in the vicinity of the first surface S1 c. The argon added area 6 c includes an area indicating an argon concentration of 1×10¹⁸ cm⁻³ to 2×10²⁰ cm⁻³. The argon added area 6 c more preferably includes an area indicating an argon concentration of 2×10¹⁸ cm⁻³ to 1×10²⁰ cm⁻³. As a method for adding the argon, any method such as an ion implantation method, a sputtering method, or the like, may be used. Thereafter, through a process such as dicing, the silicon semiconductor device 1 c is manufactured (FIG. 6B).

A correlation between the argon adding conditions (pressure, temperature, and processing time) and a PL intensity according to the third embodiment is similar to that between the argon adding conditions (pressure, temperature, and processing time) and the PL intensity according to the above-described first embodiment (that is, the correlation shown in FIG. 2). Thus, a description of the correlation between the argon adding conditions (pressure, temperature, and processing time) and the PL intensity according to the third embodiment is omitted. Light-emission characteristics of the PL light emission of the silicon semiconductor device 1 c according to the third embodiment is similar to those of the silicon semiconductor device 1 a according to the above-described first embodiment (that is, the light-emission characteristics shown in FIG. 3A and FIG. 3B). Thus, a description of the light-emission characteristics regarding the PL light emission of the silicon semiconductor device 1 c is omitted.

Fourth Embodiment

Subsequently, with reference to FIG. 7A, FIG. 7B, FIG. 7C, FIG. 7D, FIG. 7E, and FIG. 7F, a method for manufacturing a silicon device according to a fourth embodiment will be described. The silicon device according to the fourth embodiment is a silicon semiconductor device 1 d. First, a silicon substrate 2 d (silicon material) is prepared (FIG. 7A). The silicon substrate 2 d includes a first surface S1 d and a second surface S2 d opposite the first surface S1 d. The silicon substrate 2 d includes a silicon area 3 d. The silicon area 3 d is arranged so as to have a thickness inwardly from the first surface S1 d of the silicon substrate 2 d. The silicon area 3 d is an impurity layer that contains impurities indicating a first conductivity type, and is configured of either one of porous silicon or beta iron silicide (β-FeSi₂). The remaining area of the silicon substrate 2 d, other than the silicon area 3 d, is formed of single crystal silicon, for example.

Subsequently, a silicon layer 4 d is formed on the first surface S1 d of the silicon substrate 2 d (FIG. 7B). The silicon layer 4 d contains impurities that indicate a second conductivity type different from the first conductivity type. A pn junction portion is formed by the silicon substrate 2 d (in particular, the silicon area 3 d) and the silicon layer 4 d. The silicon layer 4 d includes a third surface S3 d opposite a junction surface with the silicon substrate 2 d. The thickness of the silicon layer 4 d is approximately 50 nm to several μm. In the fourth embodiment, when the silicon area 3 d is configured of the porous silicon, the first conductivity type is a p-type and the second conductivity type is an n-type; and, when the silicon area 3 d is configured of the beta iron silicide, the first conductivity type is the n-type and the second conductivity type is the p-type. On the other hand, when the silicon area 3 d is configured of the porous silicon, it may be possible that the first conductivity type is the n-type and the second conductivity type is the p-type; and when the silicon area 3 d is configured of the beta iron silicide, it may be possible that the first conductivity type is the p-type and the second conductivity type is the n-type.

By using the HIP device, the argon is then added from the third surface S3 d of the silicon layer 4 d. In this case, the silicon substrate 2 d is mounted on a substrate-loading base within the HIP device. The second surface S2 d of the silicon substrate 2 d is in contact with the surface of the base. The third surface S3 d is exposed for 30 minutes to 6 hours to an argon-containing atmosphere which is adjusted to temperatures of 400° C. to 900° C. and pressures of 4 MPa to 200 MPa. Thereby, the argon is added from the third surface S3 d. The addition of the argon forms an argon added area 6 d (FIG. 7C). Argon adding conditions are: under the argon atmosphere, pressures of 4 MPa to 200 MPa; temperatures of 400° C. to 900° C.; and a processing time of 30 minutes to 6 hours. The argon added area 6 d is an area to which the argon is added, and is formed in a semiconductor area formed of the silicon substrate 2 d and the silicon layer 4 d. The argon added area 6 d is formed from the third surface S3 d of the silicon layer 4 d to the inside of the above-described semiconductor area.

In FIG. 7F, an argon concentration profile in the argon added area 6 d is shown (shown by reference numeral P4 in the graph). The argon is distributed from a surface depth position z7 of the silicon layer 4 d to a depth position z8 that is deeper than the silicon area 3 d within the silicon substrate 2 d.

As shown by reference numeral P4 in the graph, the argon concentration has its peak in the vicinity of the third surface S3 d. In an example shown in the argon concentration profile, the argon added area 6 d ranges from the third surface S3 d of the silicon layer 4 d, including the silicon layer 4 d and the silicon area 3 d, to the interior of the silicon substrate 2 d. The argon added area 6 d in a case where the silicon area 3 d is configured of the porous silicon includes an area that indicates an argon concentration of 1×10¹⁸ cm⁻³ to 2×10²⁰ cm⁻³. The argon added area 6 d more preferably includes an area indicating an argon concentration of 2×10¹⁸ cm⁻³ to 1×10²⁰ cm⁻³. The argon added area 6 d in a case where the silicon area 3 d is configured of the beta iron silicide includes an area that indicates an argon concentration of 1×10¹⁸ cm⁻³ to 1×10²⁰ cm⁻³. The argon added area 6 d more preferably includes an area indicating an argon concentration of 2×10¹⁸ cm⁻³ to 1×10²⁰ cm⁻³. As a method for adding the argon, any method such as an ion implantation method, a sputtering method, or the like, may be used.

Subsequently, a passivation film 83 is formed on the third surface S3 d of the silicon layer 4 d (FIG. 7D). A passivation film 8 d is a silicon oxide film, for example. Next, a contact hole H1 d is arranged in this passivation film 83 to form the passivation film 8 d, and a second electrode 14 d is formed on the passivation film 8 d and a first electrode 12 d is formed on the second surface S2 d of the silicon substrate 2 d. The first electrode 12 a and the second electrode 14 a are made of a conductive metal (aluminum or the like, for example). Thereafter, through a process such as dicing, the silicon semiconductor device 1 d is manufactured (FIG. 7E).

A correlation between argon adding conditions (pressure, temperature, and processing time) and a PL intensity according to the fourth embodiment is similar to that between the argon adding conditions (pressure, temperature, and processing time) and the PL intensity according to the above-described first embodiment (that is, the correlations shown in FIG. 2A, FIG. 2B, and FIG. 2C). Thus, a description of the correlation between the argon adding conditions (pressure, temperature, and processing time) and the PL intensity according to the fourth embodiment is omitted.

Subsequently, with reference to FIG. 8A, FIG. 8B, FIG. 9A, and FIG. 9B, light-emission characteristics of the silicon semiconductor device 1 d manufactured by a method for manufacturing the silicon device according to the above-described fourth embodiment will be described. FIG. 8A shows data indicating PL light-emission characteristics of the silicon semiconductor device 1 d having a silicon area 3 d configured of the porous silicon, and FIG. 8B shows data indicating EL light-emission characteristics of the silicon semiconductor device 1 d having a silicon area 3 d configured of the porous silicon. Both the data shown in FIG. 8A and FIG. 8B are measured at room temperature. FIG. 8A shows data (data indicated by reference numeral A5 in the graph) indicating a correlation between a wavelength of the PL light emission and a PL intensity in the silicon semiconductor device 1 d at an argon concentration of approximately 1×10¹⁹ cm⁻³. FIG. 8A also shows data (data indicated by reference numeral A6 in the graph, and this data is obtained by magnifying the actual data by 50 times) indicating a correlation between a wavelength of a PL light emission and a PL intensity in the silicon device to which no argon is added. A horizontal axis of the graph shown in FIG. 8A represents a wavelength (nm) of the PL light emission, and a vertical axis thereof represents a PL intensity (arb. units). According to the data shown in FIG. 8A, the PL intensity (0.92 μm band) of the silicon semiconductor device 1 d at an argon concentration of approximately 1×10¹⁹ cm⁻³ increases by 100 times or more than the PL intensity (0.92 μm band) of the silicon device to which no argon is added. As described above, in the silicon semiconductor device 1 d at an argon concentration of approximately 1×10¹⁹ cm⁻³, the PL intensity is significantly improved.

In the silicon device to which no argon is added, a peak of the PL light emission is approximately 1150 nm. On the other hand, in the silicon semiconductor device 1 d at an argon concentration of approximately 1×10¹⁹ cm⁻³, the peak shifts to approximately 922 nm.

FIG. 8B shows a correlation between the argon concentration of the silicon semiconductor device 1 d and a EL intensity in a 922 nm band. A horizontal axis of the graph shown in FIG. 8B represents an argon concentration (cm⁻³), and a vertical axis thereof represents an EL intensity (arb. units). According to the data shown in FIG. 8B, when the EL intensity in a case where no argon is added is “1” (units), the EL intensity at an argon concentration of 1×10¹⁸ cm⁻³ (see data of reference numeral D18 in the graph) to 2×10²⁰ cm⁻³ (see data of reference numeral D19 in the graph) increases by 30 times to 100 times or more, as compared to a case where no argon is added. As described above, the EL intensity is significantly improved when the argon concentration is in a range of 1×10¹⁸ cm⁻³ and 2×10²⁰ cm⁻³.

In particular, the EL intensity at an argon concentration of 2×10¹⁸ cm⁻³ (see data of reference numeral D20 in the graph) to 8×10¹⁹ cm⁻³ (see data of reference numeral D21 in the graph) increases by 100 times or more, as compared to a case where no argon is added. When the concentration is within ±50% of the concentration of D21, at least the EL intensity is significantly increased. As described above, the EL intensity is significantly improved when the argon concentration is in a range of 2×10¹⁸ cm⁻³ to 8×10¹⁹ cm⁻³. Therefore, the argon concentration of the silicon semiconductor device 1 d in which the porous silicon is used is preferably in a range of 1×10¹⁸ cm⁻³ to 2×10²⁰ cm⁻³, and more preferably in a range of 2×10¹⁸ cm⁻³ to 8×10¹⁹ cm⁻³.

FIG. 9A and FIG. 9B show data indicating EL (Electric Luminescence) light-emission characteristics of the silicon semiconductor device 1 d having a silicon area 3 d configured of the beta iron silicide. Both the data shown in FIG. 9A and FIG. 9B are measured at room temperature. FIG. 9A shows data (data indicated by reference numeral A7 in the graph) showing a correlation between a wavelength of an EL light emission and an EL intensity in the silicon semiconductor device 1 d at an argon concentration of approximately 1×10¹⁹ cm⁻³. FIG. 9A also shows data (data indicated by reference numeral A8 in the graph) showing a correlation between a wavelength of an EL light emission and an EL intensity in the silicon device to which no argon is added. A horizontal axis of the graph shown in FIG. 9A represents a wavelength (nm) of the EL light emission, and a vertical axis thereof represents an EL intensity (arb. units). According to the data shown in FIG. 9A, the EL intensity (1.6 μm band) of the silicon semiconductor device 1 d at an argon concentration of approximately 1×10¹⁹ cm⁻³ increases by approximately 15 times than the EL intensity (1.6 μm band) of the silicon device to which no argon is added. As described above, in the silicon semiconductor device 1 d at an argon concentration of approximately 1×10¹⁹ cm⁻³, the EL intensity is significantly improved.

FIG. 9B shows a correlation between an argon concentration of the silicon semiconductor device 1 d and an EL intensity in a 1.6 μm band. A horizontal axis of the graph shown in FIG. 9B represents an argon concentration (cm⁻³), and a vertical axis thereof represents an EL intensity (arb. units) in the 1.6 μm band. According to the data shown in FIG. 9B, when the EL intensity in a case where no argon is added is “1” (units), the EL intensity at an argon concentration of 1×10¹⁸ cm⁻³ (see data of reference numeral D22 in the graph) to 1×10²⁰ cm⁻³ (see data of reference numeral D23 in the graph) increases by 4 times to 15 times or more, as compared to a case where no argon is added. As described above, the EL intensity is significantly improved when the argon concentration is in a range of 1×10¹⁸ cm⁻³ to 1×10²⁰ cm⁻³.

In particular, the EL intensity at an argon concentration of 2×10¹⁸ cm⁻³ (see data of reference numeral D24 in the graph) to 1×10²⁰ cm⁻³ (see data of reference numeral D23 in the graph) increases by 6 times to 15 times or more, as compared to a case where no argon is added. When the concentration is within ±50% of the concentration of 3×10¹⁹, at least the EL intensity is significantly increased. As described above, the EL intensity is more significantly improved when the argon concentration is in a range of 2×10¹⁸ cm⁻³ to 1×10²⁰ cm⁻³. Therefore, the argon concentration of the silicon semiconductor device 1 d including the beta iron silicide is preferably in a range of 1×10¹⁸ cm⁻³ to 1×10²⁰ cm⁻³, and more preferably in a range of 2×10¹⁸ cm⁻³ to 1×10²⁰ cm⁻³.

Fifth Embodiment

Subsequently, with reference to FIG. 10A, FIG. 10B, FIG. 10C, FIG. 10D, FIG. 10E, and FIG. 10F, a method for manufacturing a silicon device according to a fifth embodiment will be described. The silicon device according to the fifth embodiment is a silicon semiconductor device 1 e. First, a silicon substrate 2 e (silicon material) is prepared (FIG. 10A). The silicon substrate 2 e includes a first surface S1 e and a second surface S2 e opposite the first surface S1 e. The silicon substrate 2 e includes a silicon area 3 e. The silicon area 3 e is arranged so as to have a thickness inwardly from the first surface S1 e of the silicon substrate 2 e. The silicon area 3 e is an impurity layer that contains impurities indicating a first conductivity type, and is configured of either one of porous silicon or beta iron silicide (β-FeSi₂). The remaining area of the silicon substrate 2 e, other than the silicon area 3 e, is formed of single crystal silicon, for example.

Subsequently, by using the HIP device, the argon is added from the first surface S1 e of the silicon substrate 2 e. In this case, the silicon substrate 2 e is mounted on a substrate-loading base within the HIP device. The second surface S2 e of the silicon substrate 2 e is in contact with the surface of the base. The first surface S1 e is exposed for 30 minutes to 6 hours to an argon-containing atmosphere which is adjusted to temperatures of 400° C. to 900° C. and pressures of 4 MPa to 200 MPa. Thereby, the argon is added from the first surface S1 e. The addition of the argon forms an argon added area 6 e (FIG. 10B). Argon adding conditions are: under the argon atmosphere, pressures of 4 MPa to 200 MPa; temperatures of 400° C. to 900° C.; and a processing time of 30 minutes to 6 hours. The argon added area 6 e is an area to which the argon is added, and is formed in a semiconductor area formed of the silicon substrate 2 e and the silicon layer 4 e. The argon added area 6 e is formed from the first surface S1 e of the silicon substrate 2 e to the inside of the silicon substrate 2 e.

In FIG. 10F, an argon concentration profile in the argon added area 6 e is shown (shown by reference numeral P5 in the graph). The argon is distributed from an exposed-surface position z9 of the silicon area 3 e to a depth position z10 that is deeper than the silicon area 3 e within the silicon substrate 2 e. As shown in the argon concentration profile, the argon concentration has its peak in the vicinity of the first surface S1 e. In an example shown in the argon concentration profile, the argon added area 6 e ranges from the first surface S1 e of the silicon substrate 2 e, including the silicon area 3 e, to the interior of the silicon substrate 2 e. An argon added area 6 e in a case where the silicon area 3 e is configured of the porous silicon includes an area that indicates an argon concentration of 1×10¹⁸ cm⁻³ to 2×10²⁰ cm⁻³. The argon added area 6 e preferably includes an area indicating an argon concentration of 2×10¹⁸ cm⁻³ to 1×10²⁰ cm⁻³. An argon added area 6 e in a case where the silicon area 3 e is configured of the beta iron silicide includes an area that indicates an argon concentration of 1×10¹⁸ cm⁻³ to 1×10²⁰ cm⁻³. The argon added area 6 e more preferably includes an area indicating an argon concentration of 2×10¹⁸ cm⁻³ to 1×10²⁰ cm⁻³. As a method for adding the argon, any method such as an ion implantation method, a sputtering method, or the like, may be used.

Subsequently, a silicon layer 4 e is formed on the first surface S1 e of the silicon substrate 2 e (FIG. 10C). The silicon layer 4 e contains impurities that indicate a second conductivity type different from a first conductivity type. A pn junction portion is formed by the silicon substrate 2 e (in particular, the silicon area 3 e) and the silicon layer 4 e. The silicon layer 4 e includes a third surface S3 e opposite a junction surface with the silicon substrate 2 e. The thickness of the silicon layer 4 e is approximately 50 nm to several μm. In the fifth embodiment, when the silicon area 3 e is configured of the porous silicon, the first conductivity type is a p-type and the second conductivity type is an n-type; and when the silicon area 3 e is configured of the beta iron silicide, the first conductivity type is the n-type and the second conductivity type is the p-type. On the other hand, when the silicon area 3 e is configured of the porous silicon, it may be possible that the first conductivity type is the n-type and the second conductivity type is the p-type; and when the silicon area 3 e is configured of the beta iron silicide, it may be possible that the first conductivity type is the p-type and the second conductivity type is the n-type. Subsequently, a passivation film 84 is formed on the third surface S3 e of the silicon layer 4 e (FIG. 10D). A passivation film 8 e is a silicon oxide film, for example. Next, a contact hole H1 e is arranged in this passivation film 84 to form the passivation film 8 e, and a second electrode 14 e is formed on the passivation film 8 e and a first electrode 12 e is formed on the second surface S2 e of the silicon substrate 2 e. The first electrode 12 e and the second electrode 14 e are made of a conductive metal (aluminum or the like, for example). Thereafter, through a process such as dicing, the silicon semiconductor device 1 e is manufactured (FIG. 10E).

A correlation between argon adding conditions (pressure, temperature, and processing time) and a PL intensity according to the fifth embodiment is similar to that between the argon adding conditions (pressure, temperature, and processing time) and the PL intensity according to the above-described first embodiment (that is, the correlations shown in FIG. 2A, FIG. 2B, and FIG. 2C). Thus, a description of the correlation between the argon adding conditions (pressure, temperature, and processing time) and the PL intensity according to the fifth embodiment is omitted. Light-emission characteristics of the silicon semiconductor device 1 e according to the fifth embodiment are similar to those shown in FIG. 8A and FIG. 8B when the silicon area 3 e is configured of the porous silicon, and similar to those shown in FIG. 9A and FIG. 9B when the silicon area 3 e is configured of the beta iron silicide. Thus, a description of the light-emission characteristics of the silicon semiconductor device 1 e is omitted.

Sixth Embodiment

Subsequently, with reference to FIG. 11A, FIG. 11B, and FIG. 11C, a method for manufacturing a silicon device according to a sixth embodiment will be described. The silicon device according to the sixth embodiment is a silicon semiconductor device 1 f. First, a silicon substrate 2 f (silicon material) is prepared (FIG. 11A). The silicon substrate 2 f includes a first surface S1 f and a silicon area 3 f. The silicon area 3 f is arranged so as to have a thickness inwardly from the first surface S1 f of the silicon substrate 2 f. The silicon area 3 f is configured of either one of porous silicon or beta iron silicide (β-FeSi₂). The remaining area of the silicon substrate 2 f, other than the silicon area 3 f, is formed of single crystal silicon, for example.

Subsequently, by using the HIP device, the argon is added from the first surface S1 f of the silicon substrate 2 f. In this case, the silicon substrate 2 f is mounted on a substrate-loading base within the HIP device. A surface opposite the first surface S1 f of the silicon substrate 2 f is in contact with the surface of the base. The first surface S1 f is exposed for 30 minutes to 6 hours to an argon-containing atmosphere which is adjusted to temperatures of 400° C. to 900° C. and pressures of 4 MPa to 200 MPa. Thereby, the argon is added from the first surface S1 f. The addition of the argon forms an argon added area 6 f. Argon adding conditions are: under the argon atmosphere, pressures of 4 MPa to 200 MPa; temperatures of 400° C. to 900° C.; and a processing time of 30 minutes to 6 hours. The argon added area 6 f is an area to which the argon is added within the silicon substrate 2 f. The argon added area 6 f is formed from the first surface S1 f of the silicon substrate 2 f to the inside of the silicon substrate 2 f.

In FIG. 11C, an argon concentration profile in the argon added area 6 f is shown (shown by reference numeral P6 in the graph). The argon is distributed from an exposed-surface position z11 of the silicon area 3 f to a depth position z12 that is deeper than the silicon area 3 f within the silicon substrate 2 f. As shown in the argon concentration profile, the argon concentration has its peak in the vicinity of the first surface S1 f. The argon added area 6 f in a case where the silicon area 3 f is configured of the porous silicon includes an area that indicates an argon concentration of 1×10¹⁸ cm⁻³ to 2×10²⁰ cm⁻³. The argon added area 6 f more preferably includes an area indicating an argon concentration of 2×10¹⁸ cm⁻³ to 1×10²⁰ cm⁻³. The argon added area 6 f in a case where the silicon area 3 f is configured of the beta iron silicide includes an area indicating an argon concentration of 1×10¹⁸ cm⁻³ to 1×10²⁰ cm⁻³. The argon added area 6 f more preferably includes an area indicating an argon concentration of 2×10¹⁸ cm⁻³ to 1×10²⁰ cm⁻³. As a method for adding the argon, any method such as an ion implantation method, a sputtering method, or the like, may be used. Thereafter, through a process such as dicing, the silicon semiconductor device 1 f is manufactured (FIG. 11B).

A correlation between argon adding conditions (pressure, temperature, and processing time) and a PL intensity according to the sixth embodiment is similar to that between the argon adding conditions (pressure, temperature, and processing time) and the PL intensity according to the above-described first embodiment (that is, the correlations shown in FIG. 2A, FIG. 2B, and FIG. 2C). Thus, a description of the correlation between the argon adding conditions (pressure, temperature, and processing time) and the PL intensity according to the sixth embodiment is omitted. Light-emission characteristics of the silicon semiconductor device 1 f according to the sixth embodiment are similar to those shown in FIG. 8A and FIG. 8B when the silicon area 3 f is configured of the porous silicon, and similar to those shown in FIG. 9A and FIG. 9B when the silicon area 3 f is configured of the beta iron silicide. Thus, a description of the light-emission characteristics of the silicon semiconductor device 1 f is omitted.

In the above-described descriptions, “approximately” of each parameter means to include an error within ±30%, and preferably means to include an error within ±10%. 

1. A method for manufacturing a silicon device, comprising steps of: forming a silicon layer that indicates a second conductivity type on a surface of a silicon material that indicates a first conductivity type; and exposing, after the step, a surface of the silicon layer for a period of a minimum of 30 minutes and a maximum of 6 hours to an argon-containing atmosphere which is adjusted to temperatures of a minimum of 400° C. and a maximum of 900° C. and pressures of a minimum of 4 MPa and a maximum of 200 MPa.
 2. A method for manufacturing a silicon device, comprising steps of: exposing a surface of a silicon material that indicates a first conductivity type for a period of a minimum of 30 minutes and a maximum of 6 hours to an argon-containing atmosphere which is adjusted to temperatures of a minimum of 400° C. and a maximum of 900° C. and pressures of a minimum of 4 MPa and a maximum of 200 MPa; and forming, after the step, a silicon layer that indicates a second conductivity type on the surface of the silicon material.
 3. A method for manufacturing a silicon device, comprising a step of exposing a surface of a silicon material for a period of a minimum of 30 minutes and a maximum of 6 hours to an argon-containing atmosphere which is adjusted to temperatures of a minimum of 400° C. and a maximum of 900° C. and pressures of a minimum of 4 MPa and a maximum of 200 MPa.
 4. The method for manufacturing a silicon device according to claim 1, wherein the silicon material includes a silicon area arranged on the surface of the silicon material and having a thickness inwardly of the silicon material from the surface, and the silicon area is formed of porous silicon or beta iron silicide.
 5. The method for manufacturing a silicon device according to claim 2, wherein the silicon material includes a silicon area arranged on the surface of the silicon material and having a thickness inwardly of the silicon material from the surface, and the silicon area is formed of porous silicon or beta iron silicide.
 6. The method for manufacturing a silicon device according to claim 3, wherein the silicon material includes a silicon area arranged on the surface of the silicon material and having a thickness inwardly of the silicon material from the surface, and the silicon area is formed of porous silicon or beta iron silicide. 